New opportunities for spintronic technology with 3-dimentional magnetism from Internet of Things to co-processors

SPICE Workshop on Nanomagnetism in 3D, April 30th - May 2nd 2024

Giovanni Finocchio

The development of more efficient and high performance spintronic devices and the efforts to have co-integration of spintronics with CMOS technology is driving the development of hybrid CMOS-spintronic solutions for applications where one can take the advantages of both technologies while minimizing their disadvantages. In this talk, I will focus on the challenges to face in designing 3-dimentional applications of magnetic structures and array of magnetic devices for application in Internet of Things and how to speed-up this process by a co-design approach which combines material, device, circuit design and integration at the same time. I will discuss on new potential applications of magnetic tunnel junctions (MTJs) as compact sensors for IoT nodes and computing applications which combined with new 3-dimentional magnetism can be more effective. Finally, I will show how a single MTJ can be used to implement a spinking neuron which does not need any reset mechanism and that is equivalent in term of behaviour to what described by the Hodgkin-Huxley model.

This work was supported under the project number 101070287 — SWAN-on-chip — HORIZON-CL4-2021-DIGITAL-EMERGING-01, the project PRIN 2020LWPKH7 funded by the Italian Ministry of University and Research., and by the PETASPIN association (www.petaspin.com). This work has been also partially funded by European Union (NextGeneration EU), through the MUR-PNRR project SAMOTHRACE (ECS00000022).